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Date: | Fri, 11 Jul 97 14:45:54 |
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Hello Fellow Internetters,
I work for ERG telecommunications, in Perth, Australia.
We have been seeing problems with the wave solder process,with two
defect types ie. Bridging (approx 12%) and solder balling(Approx 2%).
Bridging has the higher rate of the two problems.
The location that the bridging problem occurs is mainly at the front
of the boards as they pass the wave machine. Also bridging is mainly
the trailing edge type but, there are instances when it bridges
across the board..
The machine that is used, has the capability of spray and foam
fluxing. Alternating between these two fluxing types, I observed that
the foam fluxing gives better results, in most cases at 0% defect
rate. My concern with changing to foam fluxing is that the residual
contamination left after such a process is high( i am yet to test some
boards with a Ionic contamination tester). The flux that is used is
halide free Multicore X32-10i.
Does anyone have any suggestions to reduce such wave solder problems ?
Regards
Arjun Murthy
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