Subject: | |
From: | |
Date: | Tue, 8 Jul 1997 12:53:37 -0400 |
Content-Type: | text/plain |
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Hi Peter,
We have been using reflowed SN/PB on our PWA for several years and have
found that it works very well with Fine pitch as well as chip
components.
Hector Valladares
Honeywell Space Systems
813-539-3683
> ----------
> From: peter dahlen[SMTP:[log in to unmask]]
> Sent: Tuesday, July 08, 1997 10:41 AM
> To: [log in to unmask]
> Subject: ASSEM
>
>
> Hello,
>
> I have some questions regarding PCB for data and microwave
> applications
> which I hope someone will give me some good inputs to.
>
> Questions:
>
> I would like to have some inputs abut solderability, shelf lifte etc.
> by
> using different surface treatment onto the cu-pattern on a PCB. Your
> experience by using:
>
> a. HAL
> b. Reflowed Sn/Pb
> c. Unreflowed Sn/Pb
> d. Electroless nickel/gold
> e. Organic passivation
> f. Other
>
> And above surface treatments in combination with:
>
> a. Surface mounted chip components
> b. Surface mounted fine-pitch IC
> c. "Standard" hole mounted components
>
>
> Best Regards
>
> Peter Dahlén
>
> Saab Ericsson Space
> [log in to unmask]
> fax. +46 31 359520
>
>
>
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