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Date: | Thu, 31 Jul 1997 11:35:13 -0400 |
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Hello Everybody,
Is there a guideline on the recommended geometry of adhesive for optimum
performance on SMT components? A customer posed this question to me in
reference to a D-PAC type device. I am not familiar with this package type
so it you can provide some background like what it looks like, footprint,
etc. I would be most appreciative.
I would also like to thank everyone who responded to my request about
MIL-F-14256. I received about 20 responses and all were very helpful and
most informative. Thanks again to the entire technet!
Denis Meloche
Heraeus Cermalloy
610-825-6050
Fax 610-825-7061
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