Thanks for the information. I have not been able to find information
on Dynaco, Teledyne and EMC rigid-flex on the internet. Does anyone
know how to contact these companies? Any paper or book to recommend?
Thanks,
Yuan (303)417-5655
______________________________ Reply Separator _________________________________
Subject: Re: Rigid-flex technologies
Author: [log in to unmask] at UNIXMAIL
Date: 7/25/97 6:37 AM
There are three basic types of rigid-flex product. The oldest
versions use acrylic adhesive constructions to bond the copper to the
flex layers and have always struggled with the thermal mismatch of
the materials. With the advent of adhesiveless laminates, the
technology became more robust. Both of these technologies are
available from any of the manufacturers of rigid-flex. These
include, but are not limited to, Parlex, Dynaco, Teledyne, EMC,
Strataflex, Pioneer, Multiflex and FCI. I've tried to list them all.
The problem with rigid-flex has always been cost. Functionality is
outstanding, but the commercial world can't afford the cost. Several
technologies are available that are trying to make R/F practical for
commercial applications. Teledyne came out with the first,
Regal-Flex and that technology is avaible through GulTech, Hadco and
Teledyne. Parlex then developed the PALCore process, which uses
resin coated copper cap layers to build thin and low cost boards, and
still holds that technology exclusively. EMC had their own process
also and now Hadco has announced their HVR product that is similar to
Regal-Flex.
If you contact Hadco, Parlex, Teledyne and EMC, you will have access
to information on the key and different rigid flex technologies on
the market.
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