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Date: | Thu, 24 Jul 1997 23:00:57 -0400 |
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Denis Meloche asked for published literature on Sn62 vs Sn63
solders in a thermal cycle environment. The following
article may be of interest, also I believe the authors have
put out a few other papers on the same subject.
Cheers,
Andy
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Author(s) AU: Pao, Y.H.
Badgley, S.
Govila, R.
Jih, E.
Affiliation AF: Ford Motor Company, Dearborn, MI, USA
Title TI: Experimental and modeling study of thermal cyclic behavior
of Sn-Cu and Sn-Pb solder joints
Journal JN: Materials Research Society Symposium Proceedings
Source SO: Electronic Packaging Materials Science VII Mater Res Soc
Symp Proc v 323 1994 Publ by Materials Research Society
Pittsburgh PA USA p 153-158
ISSN/ISBN IS: 1558992227
02729172
Record Type RT: CA (Conference Article)
Conference CI: Proceedings of the Fall 1993 MRS Meeting
11/29-12/03/93
Boston, MA, USA
Conf Code CO: 20330
Language LA: English
Subject(s) SU: Soldering alloys
Soldering
Thermal effects
Thermoanalysis
Finite element method
Fatigue of materials
Thermal cyclic behavior
Sn Cu solder joint
Sn Pb solder joint
Abstract AB: Thermal cyclic shear stress/strain hysteresis response of
97Sn-2Cu-0. 8Sb-0.2Ag, 95.5Sn-4Cu-0.5Ag, 63Sn-37Pb, and
62Sn-36Pb-2Ag solder joints have been determined using a
double beam specimen. The temperature cycle had a period of
40 minutes and extreme temperatures of 40oC and
140oC. The steady state creep properties of these
solders were determined, and associated Norton's law was
implemented in a finite element program to simulate the
experiment. The fatigue life of these solders joints and
failure mechanism are also discussed.
(Author abstract)
12 Refs.
Class. Codes CC: 538.1.1
801.4
921.6
Date Indexed DI: 9410
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