J-STD-012, Implementation of Flip Chip and Chip Scale Technology, is a
jointly (IPC, EIA, MCNC, Sematech) produced document published January 1996.
It describes design considerations, assembly processes, technology
choices, application, and reliability data. Includes: flip chip, HDI,
microBGA, micro SMT, and SLICC.
To order, contact the IPC Order Deptartment at the phone number below,
or at [log in to unmask] Price: $35 IPC members; $70 nonmembers.
Mike Buetow
IPC Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700
F: 847-509-9798
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On Sun, 2 Jul 1995, david yeh wrote:
> Hi,
>
> Can anyone tell me is there a IPC specification for Flip Chip ???
>
> Many thanks!!!
>
>
> Best regards,
> David Yeh,
> Process & Development Engineer
> Seagate Technology
>
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