TECHNET Archives

July 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0wmTGS-000BjsC; Thu, 10 Jul 97 19:08 CDT
Old-Return-Path:
Date:
Fri, 11 Jul 1997 12:17:17 +1200
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
>From willli Thu Jul 10 19:
09:05 1997
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/13915
TO:
Return-Path:
<TechNet-request>
From [log in to unmask] Mon Jul 14 08:
35:07 1997
X-Status:
Resent-Message-ID:
<"DOKnb2.0.KET.FcNnp"@ipc>
Subject:
From:
Jesse Dijkstra <[log in to unmask]>
X-Loop:
Cc:
X-Mailer:
Novell GroupWise 4.1
Message-Id:
Parts/Attachments:
text/plain (24 lines)
I was interested to see some discussion on the use of SMD shields pre
reflow.  Is there anybody out there who has experience with the use of
shields for RF shielding and is willing to divulge information?  I am
interested particularly in:
-drawn shields versus folded shields
-thermal dynamics of shield use.

Any comments much appreciated.

Cheers
Jesse 
Tait Electronics, New Zealand

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2