Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="US-ASCII" |
>From willli Wed Jul 9 18: |
25:07 1997 |
Date: |
Wed, 09 Jul 1997 16:37:28 -0700 |
Precedence: |
list |
Resent-From: |
|
Cc: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
From [log in to unmask] Thu Jul 10 08: |
50:22 1997 |
TO: |
|
Return-Path: |
<TechNet-request> |
X-Loop: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0wm66K-000BjgC; Wed, 9 Jul 97 18:24 CDT |
Resent-Message-ID: |
<"AqI602.0.aS9._s1np"@ipc> |
Subject: |
|
From: |
|
Old-Return-Path: |
|
Resent-Sender: |
|
X-Mailer: |
Microsoft Mail via PostalUnion/SMTP for Windows NT |
Message-ID: |
|
Parts/Attachments: |
|
|
Did BGA (PWB?) substrate warp, causing the non-contacts?
Did the motherboard PWB that the BGA is reflowed to warp?
-Michael Alderete
Aerojet
----------
From: rob starr[SMTP:[log in to unmask]]
Sent: Wednesday, July 09, 1997 4:13 PM
To: ipc
Subject: BGA Question
Hello there, an engineer friend of mine suggested asking this question to
this address for advise.
I have some separation of BGA contact from PCBs, the pad size is 20 mil,
the balls are 30 mil, the pitch is 50 mils. the board is Fr-4 , 0.062 ".
4
layer
is this configuration acceptable or what changes to the pad could be made
to improve solderability?
thanks in advance,
[log in to unmask]
**************************************************************************
*
* TechNet mail list is provided as a service by IPC using SmartList v3.05
*
**************************************************************************
*
* To subscribe/unsubscribe send a message <to: [log in to unmask]>
*
* with <subject: subscribe/unsubscribe> and no text in the body.
*
**************************************************************************
*
* If you are having a problem with the IPC TechNet forum please contact
*
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]
*
**************************************************************************
*
------ Message Header Follows ------
Received: from ag.aes.com by iegate.aes.com
(PostalUnion/SMTP(tm) v2.1.9f for Windows NT(tm))
id AA-1997Jul09.161323.1557.71642; Wed, 09 Jul 1997 16:13:25 -0700
Received: from simon.ipc.org by ag.aes.com (8.8.5/8.6.9) with SMTP id
QAA26337;
Wed, 9 Jul 1997 16:00:15 -0700 (PDT)
Received: from ipc.org by simon.ipc.org via SMTP
(940816.SGI.8.6.9/940406.SGI)
id RAA01838; Wed, 9 Jul 1997 17:49:42 -0700
Resent-Date: Wed, 9 Jul 1997 17:49:42 -0700
Received: by ipc.org (Smail3.1.28.1 #2)
id m0wm5Yw-000BkxC; Wed, 9 Jul 97 17:50 CDT
Resent-Sender: [log in to unmask]
Old-Return-Path: <[log in to unmask]>
Message-Id: <[log in to unmask]>
From: "rob starr" <[log in to unmask]>
To: "ipc" <[log in to unmask]>
Subject: BGA Question
Date: Wed, 9 Jul 1997 16:00:29 -0700
X-MSMail-Priority: Normal
X-Priority: 3
X-Mailer: Microsoft Internet Mail 4.70.1155
MIME-Version: 1.0
Content-Type: text/plain; charset=ISO-8859-1
Content-Transfer-Encoding: 7bit
Resent-Message-ID: <"dzOy32.0.MJN.VM1np"@ipc>
Resent-From: [log in to unmask]
X-Mailing-List: <[log in to unmask]> archive/latest/13880
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|