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| >From willli Wed Jul 9 09: |
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We UV bump after thermal cure and have found there to be a major
reduction in our Ionic contamination levels, therefore; creating
a harder and tighter surface. I have not tested for the
difference in pencil strength.
______________________________ Reply Separator _________________________________
Subject: U.V. cure of L.P.I. soldermasks
Author: <[log in to unmask]> at INTERNET
Date: 7/9/97 8:50 AM
I have a question in regard to the curing of L.P.I.
soldermasks. Many people cure their screened boards thermally only,
with no U.V. "bump". Other people insist that the additional U.V.
cure is needed to make the mask stronger 'pencil strength scale".
Some people claim that the amount of hardness that the U.V. cure adds
is so insignifigant to a properly thermally cured board, that it is a
waste of valuable time to perform this operation. I am looking for
some input on what other people have found in regard to this issue and would
greatly appreciate any feedback that I can get. Thank you.
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