 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain;
charset="iso-8859-1" |
| Old-Return-Path: |
|
| Date: |
Tue, 8 Jul 1997 12:53:37 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| Content-Transfer-Encoding: |
quoted-printable |
| Status: |
O |
| X-Mailing-List: |
|
| >From willli Tue Jul 8 11: |
41:17 1997 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| From [log in to unmask] Wed Jul 9 11: |
04:18 1997 |
| Resent-Message-ID: |
<"YumCO2.0.KLS.Vscmp"@ipc> |
| Subject: |
|
| From: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0wldK4-000Bk3C; Tue, 8 Jul 97 11:41 CDT |
| X-Priority: |
3 |
| X-Mailer: |
Internet Mail Service (5.0.1458.49) |
| Message-Id: |
|
| Parts/Attachments: |
|
|
Hi Peter,
We have been using reflowed SN/PB on our PWA for several years and have
found that it works very well with Fine pitch as well as chip
components.
Hector Valladares
Honeywell Space Systems
813-539-3683
> ----------
> From: peter dahlen[SMTP:[log in to unmask]]
> Sent: Tuesday, July 08, 1997 10:41 AM
> To: [log in to unmask]
> Subject: ASSEM
>
>
> Hello,
>
> I have some questions regarding PCB for data and microwave
> applications
> which I hope someone will give me some good inputs to.
>
> Questions:
>
> I would like to have some inputs abut solderability, shelf lifte etc.
> by
> using different surface treatment onto the cu-pattern on a PCB. Your
> experience by using:
>
> a. HAL
> b. Reflowed Sn/Pb
> c. Unreflowed Sn/Pb
> d. Electroless nickel/gold
> e. Organic passivation
> f. Other
>
> And above surface treatments in combination with:
>
> a. Surface mounted chip components
> b. Surface mounted fine-pitch IC
> c. "Standard" hole mounted components
>
>
> Best Regards
>
> Peter Dahlén
>
> Saab Ericsson Space
> [log in to unmask]
> fax. +46 31 359520
>
>
>
> **********************************************************************
> *****
> * TechNet mail list is provided as a service by IPC using SmartList
> v3.05 *
> **********************************************************************
> *****
> * To subscribe/unsubscribe send a message <to:
> [log in to unmask]> *
> * with <subject: subscribe/unsubscribe> and no text in the body.
> *
> **********************************************************************
> *****
> * If you are having a problem with the IPC TechNet forum please
> contact *
> * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]
> *
> **********************************************************************
> *****
>
>
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
