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Wed, 30 Jul 1997 12:52:57 -0800 |
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43:27 1997 |
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| From [log in to unmask] Thu Jul 31 12: |
20:42 1997 |
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Pachena Industries Ltd. |
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Hello,
Thank you for the input on BGA and Pin-in-Paste Process. I have
also found a two-parts article in June and July 97 IPC REVIEW
magazine. The paper is "Ball Grid Array, MicroBGA, Chip Scale
Packaging, and 0.4mm Ultra-Fine Pitch Implementation at U.S.
Robotics".
Could anyone tell me where I could get a copy of the followings:
1. "Developing the Paste-in-hole Process", Tom Grevascio, Group
Technologies, Surface Mount International Proceedings, 1994 or
Circuit Assembly, Oct. 1995.
2. "Through Hole Connector Soldering with Solder Paste Reflow", Bill
Barthel, Electronic Assembly Corp., Surface Mount International
Proceedings, 1994.
My fax number is (604) 291-1567.
Thanks a lot.
Steve Siu
Manufacturing/Design Engineer
Pachena Industries Ltd.
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