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July 1997

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From [log in to unmask] Thu Jul 31 11:
42:40 1997
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>From willli Mon Jul 28 15:
39:48 1997
Subject:
Mixed Technologie SMD-Soldering + COB
From:
Jeremias Michael <[log in to unmask]>
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jeremias <[log in to unmask]>
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We are assembling SMD components.
--soft soldering tinlead with noclean solder paste on Dycostrate Au
--wash with  ethyl alcohol.

--Then  AgEpoxy  die attachement COB -- curing

-- Then  US bonding Al Wedge, wedge
-- Then TS bonding Au Wedge, wedge

Some wedges lift of  !!!!!!!!.

Do You know means in production  for protect Au  surface against flux ,
or clean surface after soldering  by what ?  

Experiences with plasma cleaning?

Thank You for help



M. Jeremias

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