We are assembling SMD components.
--soft soldering tinlead with noclean solder paste on Dycostrate Au
--wash with ethyl alcohol.
--Then AgEpoxy die attachement COB -- curing
-- Then US bonding Al Wedge, wedge
-- Then TS bonding Au Wedge, wedge
Some wedges lift of !!!!!!!!.
Do You know means in production for protect Au surface against flux ,
or clean surface after soldering by what ?
Experiences with plasma cleaning?
Thank You for help
M. Jeremias
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