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July 1997

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From [log in to unmask] Mon Jul 28 09:
39:39 1997
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>From willli Thu Jul 24 18:
52:08 1997
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Subject:
BGA and Paste-Insert-Reflow
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"Steve Siu" <[log in to unmask]>
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Hello, 

Our company is currently investigating the paste-insert-reflow 
(PIR) process, aka "pin hole reflow", "intrusive reflow".  It is 
basically reflowing thru-hole component with SMT technology.
We are interested in applying PIR process to board with BGA 
component on one or both sides.  Any input is deeply appreciated.     
Thanks.  

Regards
Steve Siu
Manufacturing Design Engineer

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