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| >From willli Fri Jul 18 09: |
17:28 1997 |
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| From [log in to unmask] Mon Jul 21 16: |
02:02 1997 |
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One of the more interesting factors that I have seen, that promotes peelers,
is the use of a dilute Sulfuric dip before acid Copper plating. This is OK,
IF, the immersion time is short, and the acid changed often.
If either is not the case it can cause bad peelers, when the Copper in
solution builds up, and enough time is allowed for Cuprous salts to form,
which are nearly invisible, and when plated over will cause peelers.
Hope this helps.
Rudy Sedlak
RD Chemical Company
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