jim -
there is a difference between low copper adhesion - UNDERPLATE - and poor
copper adhesion. Check exposing to meet parameters - check strength of
developing solution - Check pressure spray on developer - Check actual
nozzles - Check breakpoint on developer - Check cleaner - Check condition of
copper bath - without definite info as to what is occurring - hard to come up
with a pinpointed answer. Hope this helps.
Regards
Richard Fudalewski
Atotech Canada Ltd
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