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| >From willli Wed Jul 16 11: |
49:40 1997 |
| From [log in to unmask] Mon Jul 21 11: |
22:40 1997 |
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by ipc.org (Smail3.1.28.1 #2)
id m0woXGa-000Bl2C; Wed, 16 Jul 97 11:49 CDT |
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There is a machine we use that does an excellent job of decapping:
The machine uses a mixture of Nitric acid and Sulfuric acid with a
timed water rinse to decap.
B&G Decapsulator
Model 250
B&G Enterprises, Inc.
2880 Research Park Drive, Suite 100
Soquel, CA 95073
408-464-6540
We use it in a lower volume lab environment, but I believe B&G has
higher throughput machines as well.
Frank Hinojos
Watkins-Johnson Co.
______________________________ Reply Separator _________________________________
Subject: Re: Decapping ICs
Author: Bogdan Gaby <[log in to unmask]> at INTERNET
Date: 7/16/97 9:31 AM
Joseph Fjelstad wrote:
>
> Hi folks!
>
> Does anyone have a favorite formula for removing the molded plastic from
> around the IC and lead frame for failure analysis?
>
> Thanks in advance to all who reply...
>
> Best to all,
> J. Fjelstad
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> ...System Building Blocks for the Next Generation of Electronics
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Hi,Joseph!
3 decapsulation methods are known to me ,which work well depending
on your appliccation.
1."Automatic" decapsulation ,done with the decapsulators from
B&G Enterprises,Inc.
2880 Research Park Drive,Suite 100
Soquel,CA 95073
408.464.6540
Fax 408.464.6549
They have several models for almost all types of packaging.
I have no experience with their product.
2.Nitric acid , manually.This is ART and needs some experience.
3.Dipping in adequate solvents from
Dynaloy,Inc.
7 Great Meadow Lane
Hanover N.J.07936
(201)887-9270
This is done also manually,and Dynaloy has a booklet on the subject.
Good luck!
GABY
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