TECHNET Archives

July 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0woWmK-000BjaC; Wed, 16 Jul 97 11:18 CDT
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_01BC91CE.A930F620"
Old-Return-Path:
<[log in to unmask]>
Date:
Wed, 16 Jul 1997 09:57:24 -0500
Precedence:
list
Resent-From:
[log in to unmask]
Resent-Sender:
TechNet-request [log in to unmask]
MIME-Version:
1.0
Status:
O
>From willli Wed Jul 16 11:
18:31 1997
From [log in to unmask] Mon Jul 21 11:
22:02 1997
X-MSMail-Priority:
Normal
Return-Path:
<TechNet-request>
X-Status:
X-Loop:
[log in to unmask]
X-Mailing-List:
<[log in to unmask]> archive/latest/14050
Content-Transfer-Encoding:
7bit
Resent-Message-ID:
<"1Tlzh.0.r-J.3HFpp"@ipc>
Subject:
DES : Question About Power Density Capabilities of PCB's
From:
"Jeff Fries" <[log in to unmask]>
TO:
"IPC Tech Support" <[log in to unmask]>
X-Priority:
3
X-Mailer:
Microsoft Internet Mail 4.70.1161
Message-Id:
<[log in to unmask]>
Parts/Attachments:
text/plain (987 bytes) , text/html (1222 bytes)

ATOM RSS1 RSS2