Wedge voids can be caused by surfactant sipping into interlayer gap
when the interlayer adhesion is poor. Associated with wedge voids are
usually pink rings. Can somebody tell me if DM can help preventing
wedge void (and also pink ring), and if so, why?
______________________________ Reply Separator _________________________________
Subject: Mechanism of Wedge Void Formation
Author: [log in to unmask] at corp
Date: 7/14/97 3:56 PM
What is the mechanism of wedge void formation and how is it to be
stopped?
We use electroless copper. I heard there was less frequency with direct
metallization. Does anyone know?
Are there multiple causes and mechanisms?
What are the frequencies of appearance?
Does anyone know quantifiable kinetics of acid copper plating on
different surfaces?
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