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>From willli Mon Jun 9 03: |
39:47 1997 |
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From [log in to unmask] Tue Jun 17 09: |
31:48 1997 |
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Phil,
I've no direct experience of failures definitely attributed to
ultrasonic cleaning, but I'd refer you to 'Reliability and Yield
problems of Wirebonding in Microelectronics' Harman, G.
ISBN: 0-930815-25-4 available from ISHM.
There is a discussion on this issue, in the book, with references.
>From my perspective, dealing with PEMs, the key message is that
cleaning frequencies >100kHz are unlikely to cause any damage.
regards
Olly
> From [log in to unmask] Fri Jun 6 19:24:55 1997
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> I have a argument going on ultrasonic cleaning of PWA's with different types
> of component.
>
> Several opinions have come up:
> (1) Never ultrasonic clean if you have hybrids with wire bond connections.
> (2) Hybrids are OK to clean in an ultrasonic if an encapsulant is used.
> (3) Hybrids are OK to clean if they supplier follows standard wire bond
> requirements.
> (4) Do any of the above rules apply to multichip modules.
> (5) Do Ball Grid Array fall in any of the above categorties.
>
> Phil Hinton
> [log in to unmask]
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