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35:57 1997 |
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Hello,
I am interested in testing solderability of printed circuit boards.
There are 5 techniques mentioned in ANSI/J-STD-003 "Solderability
Tests for Printed Boards". They are : Edge dip, rotary dip , float,
wave, and wetting balance. The first three are done in a solder pot.
There is another method called "SERA Testing" that is not mentioned.
Do any of these prove reliable in predicting a boards performance
during assembly? Is it better to age the samples before testing? If so
then is steam aging the best method?
Interpretation of results seems to have a certain amount of
latitude. Is there a comprehensive authoritative work on the subject.
Some of the contacts for equipment manufactures mentioned in
section 6 of the document mentioned above are no longer valid. Are
there still sources for this equipment?
There is no source for wave solder testing equipment listed. Is
there a lab scale unit available?
I am interested in presenting a paper in September at the IPC
Summit on PWB Surface Finishes and Solderability in September titled
something like "Survey of Solderability Testing Techniques". I plan on
using information gathered on TECHNET in this paper. If you have
information and wish to assist please contact me.
Thanks
Rich
------------------------------------------------------------------
Richard Olsen Telephone (602)-232-9154
Continental Circuits Corp. Main (602)-268-3461
3502 East Roeser Road Fax (602)-268-0208
Phoenix Arizona Pager (602)-310-6245
85040-2905 Internet [log in to unmask]
USA I make circuit boards,what do you do?
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