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June 1997

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>From willli Mon Jun 23 15:
43:12 1997
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From [log in to unmask] Tue Jun 24 16:
35:13 1997
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Subject:
FAB: tin only over copper on antenna design
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Ed Cosper <[log in to unmask]>
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We have a design that calls for a Arlon teflon material with embedded ceramic. This is basically a print and etch design with two large antenna traces that requires solder coverage. The problem we are currently having is the material is delaminating during HAL. Our temp. is only 490F with a dwell time of 2.5 seconds. 

What I am wondering is three things..

1. Should it be necessary to bake teflon immediately prior to HAL?
2. What is the possibility of the material being bad? Anyone had similar issues?
3. From a design/reliability standpoint, would leaving only a tin plated finish over the copper 
    antenna be a problem.
    Note: Our customer is looking into this but doesn't seem to have any answers yet.

Any and all comments would be appreciated. We are looking for feedback to provide our 
customer with alternatives.


Sincerely,

Ed Cosper 

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