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| >From bergdi Tue Jun 3 01: |
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| From [log in to unmask] Tue Jun 3 08: |
54:04 1997 |
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Has anyone out there implemented, in high-volume production, a horizontal
replacement for conventional black or brown oxide ('durabond' or equiv.)
in-line with D/E/S, i.e. effecting the [efficient] route:
Image/Dev/Etch/Strip/Tin/PE-Punch/AOI/Lay-up? If so, how well does the imm.
Sn withstand handling damage? Must there be some sort of aqueous cleaning
after AOI prior to Lam? Are bond strengths acceptable & do they pass
thermal testing? Have customers/designers voiced concerns about long-term
reliability? Is there any effect, good or bad, on signal integrity, esp. at
high speeds?
J.Felts
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