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| >From willli Mon Jun 16 10: |
42:39 1997 |
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| From [log in to unmask] Tue Jun 17 11: |
37:45 1997 |
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On Mon, 16 Jun 1997, Lenny Kurup wrote:
> To: Last few em, concerning the stripping of lpism after thermal curing.
>
>
> Epoxy based lpism are practically impossible to strip and it is my
> recommendation that you not attempt to strip these boards. The main problem
> is attack of the butter layer by the solvent in the stripping chemistry and
> the heat effect.
>
> Aqueous lpism can be stripped by a proprietary chemistry (RBP-CHEMELEX
> solder mask remover), within 3 hours at about 130 F. The butter layer is
> not attacked by any harsh solvents and the immersion time is greatly
> reduced from the 48 hours, previously described, hence the heat effect is
> greatly reduced.
>
>
> Good Luck,
>
> Lenny Kurup
> [log in to unmask] (for more details)
>
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