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| From [log in to unmask] Tue Jun 17 11: |
07:45 1997 |
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<"0Z0tz.0.vT8.k43ep"@ipc> |
| >From willli Thu Jun 12 12: |
26:32 1997 |
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At 06:52 PM 6/11/97 -0500, you wrote:
>I would like to take an informal survey of BGA pad design styles.
>
>
>1. Are you using soldermask defined pads or pads that are clear of
>mask? (by soldermask defined pads I mean, the copper land is larger
>than the soldermask opening allowing the soldermask to define the BGA
>attachment site)
>WE DO NOT USE SOLDERMASK DEFINED PADS.
>2. If you use Soldermask defined pads do you allow the soldermask to
>fall off the pad (misregistration)? If not how much registration do
>you allow for to keep the soldermask on the pad?
>
>3. Do you experience problems with mask lifting during rework?
>YES WE DO HAVE MASK LIFTING. SOME OF IT IS IN AREAS WHERE WE MASK AREAS
LESS THAN .005". WE ARE CONSIDERING REMOVING MASK UNDER OUR BGA PARTS.
>
>Thanks for the help..looking forward to the discussion.
>
>
>
>Douglas Jeffery
>Electrotek,Inc.
>
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>
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