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June 1997

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>From willli Wed Jun 11 10:
51:17 1997
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Wed, 11 Jun 1997 11:59:45 -0400 (EDT)
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Subject:
FEB: ceramic BGA cracking after wave solder
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Sheila Smith <[log in to unmask]>
From [log in to unmask] Tue Jun 17 10:
46:39 1997
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We are experiencing cracking of large (1.8" on a side) ceramic BGA cracking
(like in half) following wave solder.  The devices are on polyimide boards.
This is a new program -- any advice on things we might do better or
different ... bake the boards before we stuff them?  fixture boards during
wave solder? go back to our board supplier for resolution?  Thanks for any
help...

Sheila Smith, Tracor AES

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