TECHNET Archives

June 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Wed, 11 Jun 1997 10:04:47 -0400
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/13303
X-Sender:
TO:
>From willli Wed Jun 11 08:
50:29 1997
Return-Path:
<TechNet-request>
X-Loop:
Resent-Message-ID:
<"HT2dL1.0.LgP.Xqgdp"@ipc>
Subject:
From:
sam mccorkel <[log in to unmask]>
Received:
by ipc.org (Smail3.1.28.1 #2) id m0wbnn8-000BjGC; Wed, 11 Jun 97 08:50 CDT
From [log in to unmask] Tue Jun 17 10:
42:41 1997
X-Mailer:
Windows Eudora Light Version 1.5.2
Message-Id:
Parts/Attachments:
text/plain (18 lines)
Is it an accepted practice to tin plate ( for an etch resist ) and then hot
air solder level over the tin?
We're considering this for SMOTL finishes but have concerns about the tin
plated boards going into the HAL.
Does anyone know if we're asking for trouble or do other manufacturer's do
the same?

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2