TECHNET Archives

June 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0wbmPx-000BjMC; Wed, 11 Jun 97 07:22 CDT
Old-Return-Path:
Date:
Wed, 11 Jun 1997 08:32:36 -0400 (EDT)
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/13297
From [log in to unmask] Tue Jun 17 10:
41:17 1997
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"ZVi5M.0.zpC.0Yfdp"@ipc>
Subject:
>From willli Wed Jun 11 07:
22:49 1997
X-Loop:
Message-ID:
From:
Parts/Attachments:
text/plain (22 lines)
Regarding tented vias, my concerns are the same
as Bob's.  We see problems such as:
1)  bare copper in the center of the hole where 
the solder mask does not reach
2)  plugged on one end and not the other - makes
a dandy cup to trap any liquid materials the board
sees after solder mask application - 

Susan Mansilla
Robisan Laboratory

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2