TECHNET Archives

May 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Date:
Sun, 11 May 1997 05:57:14 -0400 (EDT)
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
John,

The gold will stand up to most single component nitric solder strippers. The
potential issue will be any nickel that is not encapsulated with either gold
or photoresist. Th e nickel will strip even faster than the tin or tin/lead.

My Best,

Chris McGary

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2