TECHNET Archives

May 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Lang, Michael" <[log in to unmask]>
Date:
Thu, 01 May 97 13:22:00 E
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)

We fabricate a micro-electronics device in house with 200 leads on 0.025" 
pitch.  Before we seal it, we electrically test it, which requires that we 
remove the tie bar.  Doing so leaves all of the leads susceptible to damage.

We tried using pressure sensitive adhesive and G-10 strips to hold the 
leads, but this causes problems at leak testing...  (The pressure sensitive 
adhesive absorbs the helium which results in false leakers)

Does anyone have an idea for non-conductive tie bars?  I am looking into the 
use of UV curable adhesive, and will report usefulness to the group.  I have 
asked for some samples and will use it to perform leak testing first.

Thanks,

Michael Lang
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2