In January, Bill Barthel of Electronic Assembly Corp (Plexus) and Phil
Zarrow of ITM presented excellent papers on implementation of intrusive
reflow (AKA paste-in-hole, pin-in-paste) at the EMPF facility in
Indianapolis. You may be able to get copies from EMPF. Contact their
learning center at 317-655-3679. Also, I have found useful, the AMP
connector company has their requirements/calculations for intrusive reflow
for connectors on their homepage at www.amp.com/product/articles
 We have implemented the intrusive reflow process as of March with very good
results. Good Luck.

At 07:15 AM 5/7/97 +0000, you wrote:
>Hey Techies,
>I know someone out there has my answers.
>I read a recent posting pertaining to a technique described as 
>Intrusive reflow.  This is a process of reflow soldering thru hole 
>components.  From a design for manufacturability view what do we need 
>to do special in our design to take advantage for this technique.
>
>Does the board require any special layout ?
>
>Do I need to modify the solder paste layer output ?
>
>What other considerations need to be taken into account in order to 
>add one or two components to a surface mount board with out adding 
>extra costs and subsequent processes.
>
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----------------------------------
Jeffery L. Hempton              Phone: (219) 429-7335   Fax: (219) 429-4688
Boardshop Manufacturing Engineer			Mail Stop: 25-31
Hughes Defense Communications                           
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]

"Always remember the distinction between contribution and commitment. Take
the matter of bacon and eggs: The chicken makes a contribution. The pig
makes a commitment".--Jack Mack Carter

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