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May 1997

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Subject:
Assy: Intrusive Reflow techniques
From:
"Mark F. Hanrahan" <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 7 May 1997 07:15:07 +0000
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Hey Techies,
I know someone out there has my answers.
I read a recent posting pertaining to a technique described as 
Intrusive reflow.  This is a process of reflow soldering thru hole 
components.  From a design for manufacturability view what do we need 
to do special in our design to take advantage for this technique.

Does the board require any special layout ?

Do I need to modify the solder paste layer output ?

What other considerations need to be taken into account in order to 
add one or two components to a surface mount board with out adding 
extra costs and subsequent processes.

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