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May 1997

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Subject:
Re: intrusive reflow
From:
"Johannes Sivula"<[log in to unmask]>
Date:
Wed, 7 May 1997 14:56:45 +0300
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Hi,

In this method ordinary through -hole components are soldered using reflow.
There are small annular rings around every pin to be soldered.
Solder paste is deposited on and outside the annular ring and the capillary
action of the smolten solder draws it to the lead.

Plastic used in bodies of components must stand the reflow temperature.

Intrusive reflow allows soldering of high density and self-nesting
interconnects
without secondary operations such as hand soldering.

Brs, Johannes


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