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May 1997

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Subject:
Immersion Ni/Au
From:
John Gordon <[log in to unmask]>
Date:
Tue, 6 May 1997 06:27:04 -0700
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We are investigating the addition of an electroless nickel/gold process at
our facility.  I would appreciate any input on pros and cons as well as
whose process is preferred in "the trenches".  Also, how is the "LPI
breakdown" issue being addressed?

Thanks in advance,

John Gordon
Operations Manager
LANmark Circuits
(916)272-7280

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