MR.P.V.KHAN.LINAKS
    Following are few suggestion to overcome the problem
    1.Rough electroless copper plating or brittle electroless
     copper can cause this problem.This is due to excessive or
    low STABILISER IN ELECTROLESScopper bath.Analyse and bring
     it to the optimum.
    2.Reduce electroless copper plating time to maintain
     thickness between 1.8 to2.0 micron.
    3.Control and maintain microetching rate at patternplating
     between 0.2 to0.4 micron.
    4.Avoid mixing anode sludge with copper plating solution
    due to torn PP anode bags.Replace torn pp anode bags.
    5.Please check whether bath life of any pth line chemistry
     or de-smear line chemistry is extended. IF SO replace the
     bath .Compare the quality of d/s pth with MLB pth quality
     if you are a MLB manufacturer ,to confirm the problem is
     from DRILLING.If so run the D/S panels through DE-SMEAR
     PROCESS and check the quality after pattern plating.Make
     sure de-smear chemistry is maintained properly.
    6.Work closely with vendor demand SMOOTH FINE GRAINED AND
    DUCTILE ELECTROLESS COPPER DEPOSITION AS WELL AS ELECTRO
    PLATING COPPER DEPOSITION

    Hope the above suggestion helps.

    Regards
    Padmanabha A.H.
    Chemical Process Engineer

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