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May 1997

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Subject:
From:
"Charles Elliott" <[log in to unmask]>
Date:
30 May 1997 15:35:44 U
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Subject: FWD>ASSY: What is an HSOP ?                      1997.05.292:07 PM

Hello TechNet,
I am resending.  Original message bounced back.
I apologize if it appears twice.
Charles.

--------------------------------------
Date: 1997.05.29 2:12 PM
From: Charles Elliott
Hello TechNetters,

I have come across a package type (plastic package) called an HSOP.
I am not familiar with this type of package.  It has a large exposed
heatsink area on the bottom which is 0.002 to 0.008" thou above the 
seating plane (0.050 to 0.200mm for metric folk). 

Does this heatsink area have to be soldered or attached with some
adhesive to the PCB for better thermal performance ?  Is this required ?
What are your experiences with this package ?

If you have experience with assembly of this type of device, your inputs
would be appreciated.

Regards,
Charles Elliott
NPI Process Engineering
Newbridge Networks Corp.

[log in to unmask]
Phone (613) 591-3600

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