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Date: | Thu, 29 May 1997 16:19:09 -0500 (CDT) |
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************************ C A L L F O R P A P E R S ***********************
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IPC NATIONAL CONFERENCE
A SUMMIT ON PWB SURFACE FINISHES & SOLDERABILITY
SEPTEMBER 22-23, 1997 - BLOOMINGTON, MN
HOLIDAY INN SELECT INTERNATIONAL AIRPORT
Recent innovations in component packaging pose significant technical
challenges to the printed wiring board (PWB) manufacturer. Expensive ICs
are useless if they cannot be soldered to a reliable board surface. You
can participate in the PWB industry's only forum dedicated to
advancements in the areas of solderability and surface finishing. IPC is
sponsoring a two-day national event to bring the fabrication, assembly,
OEM and supplier industries the latest information on what is becoming
the most critical link in today's sophisticated electronic products.
Papers are sought in all areas including:
--Alternative metals (Au/Ni, Pd/Ni, etc.)
--Deposition processes
--Environmental impact
--Assembly-related issues
--Component lead to surface finish interactions
--Organic Solder Preservatives (OSPs)
--Testing and analysis (SERA, Wetting Balance, etc.)
--End product requirements
Presentations may be thirty, forty-five, or sixty minutes in length. Some
presentations may be grouped together in a forum or panel discussion.
Papers and presentations must be non-commercial in nature, focusing on
technology rather than a company's product. It is mandatory to provide a
print-quality paper or hard copies of visuals for the conference
proceedings in order to deliver an oral presentation. The deadline for
paper submission is September 5, 1997.
To submit an abstract, please fax your presentation title and a 200-300
word description along with a biography to John Riley at 847/509-9798 or
e-mail: [log in to unmask] THE DEADLINE FOR ABSTRACT SUBMISSION IS JULY 3,
1997. You may also indicate a recommended length of time for the
presentation.
Presenters at the IPC National Conference: A Summit on PWB Surface
Finishes and Solderability will receive full conference admission,
including refreshments, lunches, and the proceedings at no charge.
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