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May 1997

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Subject:
From:
John Riley <[log in to unmask]>
Date:
Thu, 29 May 1997 16:19:09 -0500 (CDT)
Content-Type:
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****************************************************************************
************************ C A L L  F O R  P A P E R S ***********************
****************************************************************************

                           IPC NATIONAL CONFERENCE
              A SUMMIT ON PWB SURFACE FINISHES & SOLDERABILITY

                  SEPTEMBER 22-23, 1997 - BLOOMINGTON, MN
                  HOLIDAY INN SELECT INTERNATIONAL AIRPORT                

Recent innovations in component packaging pose significant technical 
challenges to the printed wiring board (PWB) manufacturer. Expensive ICs 
are useless if they cannot be soldered to a reliable board surface. You 
can participate in the PWB industry's only forum dedicated to 
advancements in the areas of solderability and surface finishing. IPC is 
sponsoring a two-day national event to bring the fabrication, assembly, 
OEM and supplier industries the latest information on what is becoming 
the most critical link in today's sophisticated electronic products.

Papers are sought in all areas including:
--Alternative metals (Au/Ni, Pd/Ni, etc.)
--Deposition processes
--Environmental impact
--Assembly-related issues
--Component lead to surface finish interactions
--Organic Solder Preservatives (OSPs)
--Testing and analysis (SERA, Wetting Balance, etc.)
--End product requirements

Presentations may be thirty, forty-five, or sixty minutes in length. Some 
presentations may be grouped together in a forum or panel discussion. 
Papers and presentations must be non-commercial in nature, focusing on 
technology rather than a company's product. It is mandatory to provide a 
print-quality paper or hard copies of visuals for the conference 
proceedings in order to deliver an oral presentation. The deadline for 
paper submission is September 5, 1997.

To submit an abstract, please fax your presentation title and a 200-300 
word description along with a biography to John Riley at 847/509-9798 or 
e-mail: [log in to unmask] THE DEADLINE FOR ABSTRACT SUBMISSION IS JULY 3, 
1997. You may also indicate a recommended length of time for the 
presentation.

Presenters at the IPC National Conference: A Summit on PWB Surface 
Finishes and Solderability will receive full conference admission, 
including refreshments, lunches, and the proceedings at no charge.
                           

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