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May 1997

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Subject:
From:
JIM ENNIS <[log in to unmask]>
Date:
Thu, 29 May 97 11:44:00 PDT
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For profiles of wavesolder temperatures, I use/ have used the following 
locations

Topside PCB temp (in open area)

Bottomside PCB temp (in open area) thru a via or non plated hole

Lead of critical or heavy (ie transformer) component from topside.  This 
will show that the lead gets hot enough for adequate solder wicking up the 
lead.

If there are concerns about a particular plated hole (one that has no 
thermal relief, etc.) then we may put a thermocouple in the  hole, either 
with or without the component.

SMT components on the solder side may require a thermocouple at the lead or 
in a hole drilled in the component, which would be filled with epoxy and 
cured.  This would be to test the effect of the heat on the inside of the 
component.
 ----------
From: TechNet-request
To: technet
Subject: ASSY: MOLE temperature probes
Date: Thursday, May 29, 1997 4:46PM

Hi Technet!

A question:
To measure temperature on a PCBs you have to use a MOLE or similar with
probes (or whatever they are called).
To measure if the temperature is too high on, for example, SMDs in wave
soldering the most logic should be to put the probe on the PCB in a
SMT-components joint, right?
But where do you put the probe if you want to measure and adjust the
temperature for hole mounted components?!
We have different points of view in this matter, some say that i should
put the probes on top of the PTH and some inside the PTH.
Anyone have any suggestions?
Is there any litterature which should help?

Thanks,
Jan Merstrand
Ericsson Microwave System

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