We have profiled an IC, which we are now seeing failures on.  The max temp
on the leg of the part was 217 C.  We have been told by our supplier that
the max temp for the part is 221 C.  They are saying we are reflowing solder
internally, which causes a short, and the failure.  
        My question is, does anyone have a good idea of what the correlation
is from external temps on the leg of a part, to the internal temps of an IC.

Thanks for any ideas or data to prove us right or wrong.


Steve Quinn
Heurikon Corp
Madison, Wi

608/831-5500

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