Jim, 

If the resin recession is in zone B (para 3.6.2.3) it would be by definition
a laminate void and the rules for a laminate void would apply.  The evaluator
cannot determine how it was produced and could not determine if it existed
prior to solder floating.

I think you artificially created resin recession on the power plane by
dipping it 6 times for 10 seconds.  IPC-6012 states that you evaluate for for
resin recession after solder floating the coupon one time on the solder pot.
 If you do test sequences that are not per the test method designated in
IPC-6012 you may produce different results and the final characteristics may
not fall within the acceptability criteria shown in IPC-6012.  For example,
other test temperatures such as 371 deg C (700 deg. F) which are popular with
some users do not produce acceptable results with all materials; therefore
special conditions must be agreed on by the user and supplier.  This is what
is generally stated in IPC-6011 and would be part of the "Procurement
Documentation".     

Phil Hinton

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