Therese M. Kokocinski wrote:-
>Technetters:
>
>We're currently investigating ways to reduce the manual labor involved in taping
>PWBs with plating tape.
>
>Is there an alternative material/coating available that is less labor intensive 
>and still meets the goals of temporarily protecting the PWBs from processing 
>chemicals, and which can readily be removed without affecting the overall 
>quality of the PWB (e.g., solderability, discoloration,tackiness)?
>
>Any help will be greatly appreciated. Thanks.
>
>Teri
Hi Teri,
I don't know your application but have you considered using dry film
photo resist. It can be laminated over circuit patterns and we use it
for gold plating edge connectors. You will need to use a thicker resist,
say 2mil, to get encapsulation but it works and you can image any
complex pattern you want. Holes are tented too.

Stripping the film in a proprietary stripper with an inhibitor should
prevent the solder surface from dulling up too much although we fuse the
tin-lead or HASL after gold plating so it is not a problem for us.

There are plenty of different types of resist and one should be
available which meets your processing requirements.
-- 
Paul Gould
[log in to unmask]
Isle of Wight,UK

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