 
| Subject: | |
| From: | |
| Reply To: | R. B. RAJ |
| Date: | Fri, 2 May 1997 14:08:00 -0400 (EDT) |
| Content-Type: | TEXT/PLAIN |
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Hello Kuan-shaur Lei,
The following IEEE CPMT issues have couple of articles on ECA. Check them
up.
March 1997 Volume 20 No. 1 and
October 1996 volume 19 No. 4
Regards
Raj
Graduate Research Asst.
SUNY Binghamton
On Fri, 2 May 1997 [log in to unmask] wrote:
> Technetter
>
> I am trying to understand the state-of-art technology on electrically
> conductive adhesives which may potentially replace solder. Does anyone
> know a couple of good review articles on this topic? Of course, they need
> to be current.
>
>
> Thanks,
>
>
> Kuan-Shaur Lei, Ph.D.
> Senior Member of Technical Staff
> Advanced Technology
> Compaq Computer Corporation
> phone: 281-518-8099
> FAX; 281-518-8971
> E-mail: [log in to unmask]
>
>
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RAJKUMAR B. RAJ Residence : (607) - 797- 6821
41 Floral Avenue, Apt # 7 e-mail:[log in to unmask]
Binghamton, NY 13905
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