To the person with the solder balls on assembly boards if you contact me   
at [log in to unmask] I can help you with the problem.

 ----------
From:  TechNet-request[SMTP:[log in to unmask]]
Sent:  Thursday, May 22, 1997 6:05 AM
To:  TechNet
Subject:  Re: Solder balls

       

     Do the via plug after Hot Air Solder Leveling.  That should   
eliminate
     the problem.


______________________________ Reply Separator
_________________________________
Subject: Solder balls
Author:  [log in to unmask] at corp
Date:    5/21/97 12:34 PM


We're having problems with "solder balls" that are "resting in a nest".   
We
have .025" via holes that are covered with L.P.I. soldermask. The mask is   

collapsing when going through our vertical hot air leveler and little
"solder balls" are sitting just inside the holes. The solder balls are
falling out at subsequent operations and in some cases are ending up   
between
contact fingers that have .006" spacing between. The solder balls are
creating a short at electrical test. They are easily removed but not   
easily
detected before hand. Any ideas on what we can do to eliminate this   
problem?
       

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