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May 1997

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Fri, 23 May 1997 06:32:49 -0400 (EDT)
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Samm

The method of application for LPI's is not designed to "tent" holes like the
dry film solder masks were. Using LPI's to fill or "tent" holes will always
be a hit or miss proposition.

Suggest you change the process.

Leo Roos

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