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May 1997

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From:
Peter Swanson <[log in to unmask]>
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Date:
Thu, 22 May 1997 18:57:36 GMT
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In message <MS-MAILG-2.00-Note-pbni-JMcGee-0864299902> simon!pbni.attmail.com!PBN!PBN1!JMcGee (John McGee) writes:
> I'm looking to conform to Class 3 requirements, in staking jumper
> wires to my PC boards, per IPC-A-610B, Section 9.3.3.
> I'd sincerely like to avoid using epoxy of any type to accomplish the job.

Why? Long thermal cures or two part mixes? Rework problems? Health & safety 
(irritant)? Dispensing?

> The typical operational temperature range for most of our products is
>  -40 to +60 degrees (C).
> 
> Have any of you Military or other Class 3 types, out there, found a suitable
> substitute for epoxy, which is also deemed acceptable by your customers?
> And, if so, do you require documentation, authorizing the use of the 
> alternative method or material?

I would like to refer you to two papers:

1) UV Curable Materials for Specific Military Electronics Applications by Dr 
Olexander Hnojewyj and Mark Murdock, Litton - Navy's Third Annual Best 
Manufacturing Practices Workshop, Sept 1989.

2) Case Histories of Radiation Curing for Electronic Packaging by Peter 
Swanson -  Nepcon West 96.

Should give you some background on using UV/light curing adhesives for this 
application. They are available in MIL SPEC and Bellcore approved varieties. 
Should work fine in your thermal ranges. Most chemistries are acrylic or 
acrylated urethane based.

Yeah, I'm a big proponent. If you have any problem getting these papers, e-mail 
me off TechNet, and I'll help.

Peter
-- 
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Peter Swanson                                              Oxfordshire, England
INTERTRONICS
[log in to unmask]                      http://www.cygnetuk.demon.co.uk

Suppliers of materials and consumables to the electronics & related industries
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