Stella:
     Sounds like you have moisture in your fixtures.  What type solder 
     machine do you have, type preheat, and preheat length?  Preheat 
     capability is essential to remove all moisture off the assembly, plus 
     the fixturing.  Otherwise you will experience spattering when the 
     moisture contacts the wave.  These mini-explosions can force 
     solderballs through whatever opening are available.
     
     You may want to recheck your profile at a slower conveyor speed to dry 
     the fixture as well as the circuit card assembly (CCA) you are trying 
     to solder.  Don't forget that changing your conveyor speed, you need 
     to change preheat profiles and check quality characteristics of your 
     CCA.
     
     Just some thoughts, hope it helps.
     
     Ron
     [log in to unmask]


***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************