Gerry,
We have used the graphs and current carrying information in Harper's
"Handbook of Wiring, Cabling, and Interconnecting for Electronics",
Chapter 8, "Rigid Printed Wiring and Connector Systems", published by
McGraw-Hill, as a basis for our design rules in this respect.
A point to watch if you are in a high current rating situation is to
ensure that your VIAS are appropriately rated, and have not only
enough copper in the hole (circumference/plating thickness), but also
have sufficient copper VIA CONTACT cross-sectional area around the via
circumference, within the plane/tracking. You may need to use multiple
vias to achieve this.
Also, if your current rating is not continuous, you may be able to
down-rate. Within the plane areas, it will be the current carrying
paths that really matter - between obstacles, unconnected vias etc.
I always start with 1oz Cu and only go to 2oz if there is a (for
instance, current carrying) need. We have only used 4oz Cu for thermal
planes/thermal conductivity purposes, within a high cold wall
temperature environment (80degC), which from what you have implied,
may be similar to yours.
Hope this helps,
Clive ffitch
MBUK
______________________________ Reply Separator _________________________________
Subject: DES: Current carrying capacity of innerlayer planes
Author: [log in to unmask] at INTERNET
Date: 17-05-97 7:49
Hi All
I'm looking for a methodology for determining the current carrying
capacity of an innerlayer power plane as a function of copper weight.
Let's assume the max op temp of the laminate is 105C which allows a 30
degrees temp rise above ambient(?)
It's the old "one ounce copper versus two, three, or four ounce
copper" plane design question again ...... Data, viewpoints, and
experiences would be welcome as well. I do know that for high speed
situations, IR drop is the limiting factor. In this case, it's current
carrying capability.
Thanks in advance
Gerry
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|