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Subject:	Re: Problems with Via in Pads
From:	"dmitchel" <[log in to unmask]>
Date:	Thu, 15 May 97 08:23:09 PST
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

     Robert,

     What are the issues with the assembly process?

______________________________ Reply Separator _________________________________
Subject: Problems with Via in Pads
Author:  [log in to unmask] at corp
Date:    5/15/97 10:00 AM

Hi TechNetters,
We are experiencing assembly problems with 13.5 mil drilled vias in pad 
from one of our board suppliers. After looking at cross sections from a
sample during the problem period, I suspect that the root cause of the
problem is irregular hole walls due to drilling. My questions are regarding
the drill operation.
 How many boards are acceptable in a stack up at drill assuming .062"
  multilayer and .0135" drills?
 With the proper stack up, how many hits are acceptable for a new and/or
  a resharpened drill?
 How many times can a .0135" drill be reliably resharpened?
Any other thoughts as to the cause of rough hole walls on via holes would be
appreciated.
Thanks,
Robert Furrow at Lucent Technologies, North Andover, Ma.

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