We work in the defence industry and thus have requirements for high 
     reliability, long lifecycles and small delivery quantities.
     
     We manufacture small (and I mean small) quantities of boards but a 
     large variety including all technologies.  We have traditionally 
     carried out Environmental Stress Screening (ESS) on all our boards 
     because this continued to find (or do I mean create) faults.  This is 
     extremely expensive as we power, stimulate and monitor (PSM) during 
     ESS which necessitates significant test equipment.
     
     We are now looking at investment in a X-Ray Laminography inspection 
     machine which it is claimed could eliminate the need for ESS.
     
     Two questions therefore emerge:
     
     1  Will anyone share their Fault Spectra with us, particularly the 
     faults discovered at ESS.
     
     2  What experience does anyone have of X-Ray Laminography and how 
     valid is the claim for removing ESS. 
     
     Any information welcome,
     
     Richard

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