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May 1997

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From:
[log in to unmask] (PERARO_DJ)
Date:
Wed, 14 May 1997 07:43:23 -0400
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     Pete,
     
     I am very interested in learning more about the machine you are using 
     to de-panelize V-Scored boards.  A large percentage of the product we 
     assemble is panelized and V-Scored.  In order to facilitate the 
     separation of the individual boards, the remaining web thickness is 
     kept low, typically 12-14 mils.  Obviously, using a mechanical cutter 
     would allow a thicker web, which would provide us a more dimensionally 
     stable panel array.  Please send me the manufacturers name and number.
     
     Thank you
     
     Dominick Peraro


______________________________ Reply Separator _________________________________
Subject: Re: small pcb  "V" score
Author:  Pete Court <[log in to unmask]> at 0UTG0ING
Date:    5/14/97 9:31 AM


James.
     
How are you currently breaking out the v-scored boards? Our 
manufacturing guys use what is basically a powered, fixed, 'pizza style' 
cutter. The panels are fed in, and the blades run down the score line 
cleanly breaking out boards, thus minimizing any stress on the 
components because the boards are never 'bent'.
     
I could find out more details on the machine if you're interested.
     
Regards,
     
Pete Court
[log in to unmask]
Fujitsu Telecommunications Europe Limited
     
     
> In the past 
> when we have "V" scored small boards and then broken them away after 
> population. We have had solder joints  fracture and a large amount of 
> rework.  My question is, is there a distance that a component must be 
> from the edge of a board when using "V" scoring to prevent damage to 
> solder joints during board separation.
     
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