James.

How are you currently breaking out the v-scored boards? Our
manufacturing guys use what is basically a powered, fixed, 'pizza style'
cutter. The panels are fed in, and the blades run down the score line
cleanly breaking out boards, thus minimizing any stress on the
components because the boards are never 'bent'.

I could find out more details on the machine if you're interested.

Regards,

Pete Court
[log in to unmask]
Fujitsu Telecommunications Europe Limited


> In the past 
> when we have "V" scored small boards and then broken them away after 
> population. We have had solder joints  fracture and a large amount of 
> rework.  My question is, is there a distance that a component must be 
> from the edge of a board when using "V" scoring to prevent damage to 
> solder joints during board separation.

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